BS 1363-2 Figure 30 Temperature Rise Test Plug

This BS 1363-2 Figure 30 Temperature Rise Test Plug is a precision-engineered testing instrument developed in strict compliance with BS 1363-2 Figure 30, specifically designed to evaluate the thermal performance characteristics of 13 A switched and unswitched socket-outlets. The device integrates critical components including brass pin/clamp assemblies, a wire-wound ceramic-coated resistor, and thermal contact compound to accurately simulate operational thermal conditions. The plug’s pin projection dimensions and spatial arrangement conform to BS 1363-1:2023 Figure 4a specifications, ensuring precise compatibility with test specimens. Constructed with a robust synthetic resin bonded paper (SRBP) body per BS 2572 or BS EN 60893-3-4 standards and featuring securely soldered conductors, this test plug delivers consistent thermal generation and reliable temperature measurement performance, making it an essential instrument for compliance verification, quality assurance protocols, and research & development applications within the electrical accessory sector.

Technical Specifications

• Test standard compliance: BS 1363-2 Figure 30 (for 13 A switched and unswitched socket-outlets); pin specifications aligned with BS 1363-1:2023 Figure 4a
• Core components: Earth pin (non-connected, secured by grub screw), brass pin/clamp assembly, 1.5 mm thick brass clamp plate, wire-wound ceramic-coated resistor (e.g., 7 W 56 Ω), thermal contact compound, flexible cable
• Body material: Synthetic resin bonded paper (SRBP), as defined in BS 2572 or BS EN 60893-3-4
• Cable specifications: 1.25 mm² 2-core flexible cable, 1m length, compliant with BS EN 50525-2-11:2011
• Fastening details: Pin/clamp subassembly secured via grub screw; clamp plate tightened to 0.2 Nm torque
• Structural features: Slot for resistor leads; hole for flexible conductor; resistor leads sealed when brought out of side or cover
• Pin material: Brass (pin/clamp subassembly); pin-only components meet BS 1363-1:2023 dimensional requirements
• Compatibility: Engineered for temperature rise testing of 13 A switched and unswitched socket-outlets

Test Procedures

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